Abstract:Detection of solder paste by image processing is a new approach in the solder paste inspection. image quality is one of the keys to ensure the accuracy of image detection. The image acquisition is a vital role for the protection of image quality. It’s also a critical step in a series of processing steps to eventually obtain images useful information. This paper focuses on three main parameters of focal length, exposure and gain affecting the quality of solder paste image acquisition. The experimental demonstration of the reasonable range of the three main parameters of the focus, exposure and gain. As well as the functional relationship between shutter speed and gain. Providing a basis for the adjustment of solder paste image acquisition paramenters, but also laid the foundation for the follow-up study for parameters adjustment automatically of the paste image acquisition.