面向晶圆级芯片架构的系统仿真方法
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嵩山实验室自立项目 (221100211100)


Method for Simulating Wafer-level Chip Architecture
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    摘要:

    晶圆级芯片凭借更高的集成密度、更优的互连特性和更低的功耗, 已成为“后摩尔时代”集成电路领域未来的关键技术方向. 然而, 传统仿真方法在应对晶圆级芯片仿真时, 存在仿真效率低、跨芯粒通信建模缺失以及异构计算资源处理能力不足等问题. 针对晶圆级芯片架构的仿真需求, 本文提出了一种基于算子与芯粒协同的晶圆级芯片架构并行离散仿真方法, 通过算子与芯粒的协同并行离散仿真有效提高了系统的仿真效率. 首先, 构建基础的标准化芯粒库和算子库, 为架构仿真提供基础支持. 然后, 基于算子库将复杂应用计算任务拆分为多个算子, 协同多个芯粒实现并行离散仿真, 并结合通信模型确保了系统仿真结果的准确性. 仿真结果表明, 相对于常规的基于SST和Gem5仿真方法, 所提出的系统仿真方法不仅支持异构芯粒间通信的仿真建模, 而且在平均精度损失小于1.3%的情况下, 实现了4.8倍以上平均速度提升, 显著提升了晶圆级芯片系统的仿真效率.

    Abstract:

    Wafer-level chips, with their enhanced integration density, superior interconnect characteristics, and lower power consumption, represent a pivotal future technology in the integrated circuit field during the post-Moore era. However, conventional simulation methods suffer from low efficiency, a lack of cross-chiplet communication modeling, and inadequate handling of heterogeneous computing resources when applied to wafer-level chips. To address the simulation requirements for wafer-level chip architectures, this study proposes a parallel discrete simulation method based on the coordination of operators and chiplets. By leveraging the coordinated parallel discrete simulation of operators and chiplets, the method effectively enhances the simulation efficiency of the system. First, a foundational standardized chiplet library and an operator library are constructed to support the architecture simulation. Subsequently, complex computation tasks are decomposed into multiple operators using the operator library, and parallel discrete simulation is realized through the collaboration of multiple cores. Communication models are incorporated to ensure the accuracy of the system simulation results. Experimental results demonstrate that compared to conventional simulation methods based on SST and Gem5, the proposed approach not only supports simulation modeling of communication between heterogeneous chiplets but also achieves an average speedup of over 4.8 times with an average accuracy loss of less than 1.3%, significantly improving the simulation efficiency for wafer-level chip systems.

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侯帅康,王偲柠,邵阳雪,丁博,刘文斌,宋克,王雨.面向晶圆级芯片架构的系统仿真方法.计算机系统应用,2026,35(2):123-131

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  • 收稿日期:2025-06-27
  • 最后修改日期:2025-09-05
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  • 在线发布日期: 2025-12-29
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